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Henkel乐泰热熔胶水LOCTITE3549在线订购
Henkel乐泰热熔胶水LOCTITE3549在线订购:
本文来自:汉高乐泰胶水(中国)有限公司 Henkel Loctite官网 www.loctite.net/c1210.html
LOCTITE 3549 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved process time.
TechnicalDataSheet
LOCTITE 3549
January-2016PRCOTDIUCT35D4E9SpCroRIiPdTIO tNhefollowingproductcharacteristics: TYPICALPROPERTIESOFCUREDMATERIAL
Samplecured,1 hour@125°C
Technology Epoxy PhysicalProperties
Appearance Black -1
CoefficientofThermalExpansion ISO11359-2,K:
Components One-component BelowTg 55Product Benefits ● Reworkable AboveTg 177
● Fastflow GlassTransitionTemperature (Tg) by TMA,°C:
● Lowtemperaturecure TMAfrom-50 to300ºC@10ºC/minute 38
● Highadhesiontoflexibleandrigid Storage Modulus:
substrates DMAfrom22 to300ºC@10ºC/minute N/mm² 2,000
● Excellentprotectionforsolderjoints (psi) (290,075)
againstinducedstresses
Cure HeatCure ElectricalProperties
VolumeResistivity,IEC60093,Ω·cm 81×1015Application Underfill
SurfaceResistivity,IEC60093,Ω 0.2×1015TypppiliccaltAiosnssembly BGA andCSPDevices
LOCTITE3549reworkableepoxyunderfillisdesigned toprovide GENERALINFORMATION
protectionforsolderjointsagainstinducedstress,increasingbothdrop For safe handling information on this product, consult thetestandtemperaturecycleperformanceofthedevice. MaterialSafetyDataSheet,(MSDS).
Thisproductisnotrecommendedforuseinpureoxygenand/orTYPICALPROPERTIESOFUNCUREDMATERIAL oxygenrichsystemsandshouldnotbeselectedasasealantforDensity, @25°C, g/cm³ 1.3 chlorineor otherstrongoxidizingmaterials.
Viscosity@25°C,mPa∙s(cP):
-1 Notforproductspecifications
HaakePK100@ 36S 2,350 Thetechnicaldatacontainedhereinareintendedasreferenceonly.
Cone&Plate,Spindle52,speed50rpm 2,100 Please contact your local quality department for assistance andFillerContent,% 18 recommendationsonspecificationsforthisproduct.
PotLife @25°C(timetodoubleviscosity), days 14
ShelfLife@-25 to-15°C, days 365 RemovalProcedure
FlashPoint-SeeSDS 1. Heattheunderfilltoapproximately220°Cusingahotairnozzle
onstandardBGAreworkequipment.
TYPICALCURINGPERFORMANCE 2. Twistandremovethecomponent.
RecommendedCureSchedule 3. Useatackyfluxtogetherwithavacuumnozzleattachmentto5 minutes@120°C removeresidue.
3 minutes@130°C Storage
1 minute@150°Creflow Storeproductintheunopenedcontainerinadrylocation. StorageOptionalReflowCure(forDropTestReliability) informationmaybeindicatedontheproductcontainerlabeling.2 minutes@130°C OptimalStorage: -25 to-15°C
SubstrateTemperature Materialremovedfromcontainersmaybecontaminatedduringuse.Upto70°C Donotreturnproducttotheoriginalcontainer. HenkelCorporationDifferentialScanningCalorimetry cannotassumeresponsibilityforproductwhichhasbeencontaminatedExothermonset,°C 100 to115 orstoredunderconditionsotherthanthosepreviouslyindicated.If
additionalinformationisrequired,pleasecontactyourlocalTechnicalPeakExotherm Temperature ServiceCenterorCustomerServiceRepresentative.
Peak Temperature, °C 105 to115
The above cure profile is a guideline recommendation. Cure
conditions(timeandtemperature)mayvarybasedoncustomers'
experienceandtheirapplicationrequirements,aswellascustomer
curingequipment,ovenloadingandactualoventemperatures.
TDSLOCTITE3549, January-2016Conversions
(°Cx1.8)+32=°F
kV/mmx25.4=V/mil
mm/25.4=inches
Nx0.225=lb
N/mmx5.71=lb/in
psi x145=N/mm²
MPa=N/mm²
N·m x 8.851= lb·itn
N·mm x0.142=oz·in
mPa·s=cP
Disclaimer
Note:
rTehceoinfornmdaattiioonnsprforviduesdeandapplicationoftheproductarebasedonourinthisTechnicalData Sheet(TDS)includingthe
knowledgeandexperienceoftheproductasatthedateofthisTDS.Theproduct
canhaveavarietyofdifferentapplicationsaswellasdifferingapplicationand
workingconditionsinyourenvironmentthatarebeyondourcontrol.Henkelis,
thnereforne,itniotliaiblerfosrthetsoufitawbilityhofoouurupsrodtuhctfo,rthsewprollduactiothnepriotceesses
applicationsandresults.Westronglyrecommendthatyoucarryoutyourown
priortrialstoconfirmsuchsuitabilityofourproduct.
AnyliabilityinrespectoftheinformationintheTechnicalDataSheetoranyother
ewxrittepntiofrootraelrreiscomexmpelincditalytion(rs)eregaanrddienxgcthpeticnonrcleartnioendtporoddeuacttisrexclusded,
injurycausedbyournegligenceandanyliabilityunderanyapplicablemandatory
productliabilitylaw.
IncaseproductsaredeliveredbyHenkelBelgiumNV,HenkelElectronic
MaterialsNV,HenkelNederlandBV,HenkelTechnologiesFranceSASand
IHnencakselFraennckelSwAopldeabseeandditritohnealllysnhoetledtlhiaebfloelloowninwgh:ateverlegalground,
Henkel’sliabilitywillinnoeventexceedtheamountoftheconcerneddelivery.
IncaseproductsaredeliveredbyHenkelColombiana,S.A.S.thefollowing
disclaimerisapplicable:
Theinformation provided inthisTechnicalData Sheet(TDS)includingthe
rencoowmlemdendaatidonesxforieunsceeoafntdheappprlicatitonsofttthhedproteduocftthaireTbaSs.edeoneloiusr,
therefore,notliableforthesuitabilityofourproductfortheproductionprocesses
andconditionsinrespectofwhichyouusethem,aswellastheintended
applicationsandresults.Westronglyrecommendthatyoucarryoutyourown
prioyrltriaillisttoincorenfiremctsuocfhthseuitafbilityatoifouirptroduct.hnicalDataSheetoranyother
writtenororalrecommendation(s)regardingtheconcernedproductisexcluded,
exceptifotherwiseexplicitlyagreedandexceptinrelationtodeathorpersonal
injurycausedbyournegligenceandanyliabilityunderanyapplicablemandatory
productliabilitylaw.
Inrcas,eIpnrco.,duocrtsHarekedlelivaeraeddabyoHrenorkaetlioCno,rpthoratiolln,wRiesindiTseclahinolrogiy
applicable:
Thedatacontainedhereinarefurnishedforinformationonlyandarebelievedto
bereliable.Wecannotassumeresponsibilityfortheresultsobtainedbyothers
ovterrmwihnoesseuitmabeitlihtodfsrwtheeuser'spurposeofanyproductionmethodsmentionedhavenocontrol.It istheuser'sresponsibilityto
hereinandtoadoptsuchprecautionsasmaybeadvisablefortheprotectionof
propertyandofpersonsagainstanyhazardsthatmaybeinvolvedinthehandling
andusethereof.Inlightoftheforegoing,HenkelCorporationspecifically
disrclahiamnstabilityorfitnessforaparticularpurpose,arisingfromsaleoruseallwarrantiesexpressedorimplied, includingwarrantiesof
of Henkel Corporation’s products. Henkel Corporation specifically
disclaimsanyliabilityforconsequentialorincidentaldamagesofanykind,
including lost profits. The discussion herein of various processes or
comipnoastitionnsofispnaottttosboewinntedrpreyteodthaesrsreoprressentatiiocnetheatthnedyeraraenfreeefrokeml
Corporation patents that maycoversuch processesor compositions. We
recommendthateachprospectiveusertesthisproposedapplicationbefore
repetitiveuse,usingthisdataasaguide.Thisproductmaybecoveredbyoneor
moreUnitedStatesorforeignpatentsorpatentapplications.
Trademarkusage
Exceptasotherwisenoted,alltrademarksinthisdocu®mentare trademarksof
HenkelCorporation in theU.S. andelsewhere. denotesa trademark
registeredintheU.S.PatentandTrademarkOffice.
Reference1
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