LOCTITE乐泰Hysol胶水stycastG500汉高ECCOBOND应用订购 Emerson & Cuming G500

LOCTITE乐泰Hysol胶水stycastG500汉高ECCOBOND应用订购 Emerson & Cuming G500

本文来自：汉高乐泰胶水（中国）有限公司 Henkel Loctite官网 www.loctite.net/c1202.html

  TechnicalDataSheet

    ECCOBOND G500

    June-2011PRODUCTDESCRIPTION    TYPICALPROPERTIESOFCUREDMATERIAL

ECCOBONDG500provides thefollowingproduct    PhysicalProperties:

characteristics:    Hardness,ShoreD:

Technology    Epoxy    @25ºC    86Appearance    Grey    @120ºC    70Product Benefits    ● Onecomponent    ElectricalProperties:

    ● Non-conductive    14

    ● Generalpurpose    VolumeResistivity@25ºC,ohm-cm    2×10

    ● Sagresistant    Dielectric Strength,kV/mm    15

    ● Lowviscosity

    ● Non-abrasive

    ● Excellent dielectricproperties    TYPICALPERFORMANCEOFCUREDMATERIAL

    ● Longshelflifeatroomtemperature    TensileLapShearStrength:

    ● Excellentresistancetoheatand    Aluminum toAluminum @25ºC:

    water

    ● Highadhesionstrengthatelevated    N/mm²      17.1

    temperatures    (psi)     (2,500)Cure    Heatcure

Application    AdhesiveandSealant

Operating Temperature   -40 to+180°C

TypicalAssembly    Insulationofcopperandothermaterials    GENERALINFORMATION

Applications    andAttachingleadstocoils    Forsafehandlinginformationonthisproduct,consulttheKeySubstrates    Copper,Rigidplastics andOthermetals    MaterialSafetyDataSheet,(MSDS).

ECCOBONDG500isageneralpurposeepoxyadhesiveand    Notforproductspecifications

sealantthatcurestoahighglossfinish.    Thetechnicaldatacontainedhereinareintendedasreference.    only. Please contact your local quality department for

    assistance andrecommendations on specifications for thisTYPICALPROPERTIESOFUNCUREDMATERIAL    product.

 Density, g/cm³    1.45    DIRECTIONSFORUSE

 SagResistance,mils    750    1. CompletecleaningofthesubstratesshouldbeperformedPressFlow, seconds    45    to remove contamination such as oxide layers, dust,StorageLife@25°C, months    5.5    moisture,saltandoilswhichcancausepooradhesionorFlashPoint-SeeMSDS    corrosioninabondedpart.

    2. Some filler settling is common during shipping and

    storage. For this reason, it is recommendedthat the

    corintretntsusof.theshippingcontainer bethoroughlymixedTYPICALCURINGPERFORMANCE

CureSchedule    3. Applyadhesiveto all surfaces tobebondedand join60 minutes@125°Cor    together.

 20 minutes@150°Cor    4. Inmostapplicationsonlycontactpressureisrequired.5 minutes@175°C    5. Usable shelf life may vary depending on method ofForoptimumperformance,followtheinitialcurewithapostcureof2 to    applicationandstorageconditions.

4 hoursatthehighestexpectedusetemperature.    Storage

Alternatecureschedulesmayalsobepossible. Contactyour Henkel    Storeinoriginal,tightlycoveredcontainersinclean,dryareas.representativeforfurtherinformation.    StorageinformationmaybeindicatedontheproductcontainerThe above cure profiles are guideline recommendations. Cure    labeling.

conditions(timeandtemperature) mayvarybasedoncustomers'    OptimalStorage: 25°C. Storagebelow 25°Cor above25°Cexperienceandtheirapplicationrequirements,aswellascustomer    canadverselyaffectproductproperties.

curingequipment,ovenloadingandactualoventemperatures.

    TDSECCOBONDG500,   June-2011Materialremovedfromcontainersmaybecontaminatedduring

use. Donotreturnproducttotheoriginalcontainer. Henkel

Corporationcannotassumeresponsibilityfor productwhich

hasbeencontaminatedorstoredunderconditionsotherthan

thosepreviouslyindicated.Ifadditionalinformationisrequired,

please contact your local Technical Service Center  or

CustomerServiceRepresentative.

Conversions

(°Cx1.8)+32=°F

kV/mmx25.4=V/mil

mm/25.4=inches

N/x0.2x25.=lb=lb/in

N/mm²x145=psi

MPax145=psi

N·m x 8.851= lb·in

N·mx0.738=lb·ft

N·mm x0.142=oz·in

mPa·s=cP

Note

Thedatacontainedhereinarefurnishedforinformationonly

and are believed to be reliable. We cannot assume

responsibilityfortheresultsobtainedby othersoverwhose

methodswehavenocontrol.Itistheuser'sresponsibilityto

determinesuitabilityfortheuser'spurposeofanyproduction

methodsadmveisntiolnefdrhtereeinroatndtitonaodfopprtsurcthprecafutionrssoas

againstanyhazardsthatmaybeinvolvedinthehandlingand

usethereof.Inlightoftheforegoing,HenkelCorporationand

itsaffiliates(“Henkel”)specificallydisclaimsallwarranties

expressed  or  implied,  including  warranties  of

merchantabilityorfitnessforaparticularpurpose,arising

fromsaleoruseofHenkelproducts.Henkelspecifically

disclaims any liability for consequential or incidental

damagesofanykind,includinglostprofits.Thediscussion

ihetrerinretofdvariousrepresentationprocesses orthatcomptohsitionsreisfreenot tofrombe

dominationofpatentsownedbyothersorasalicenseunder

any Henkel patents that may cover such processes or

compositions.Werecommendthateachprospectiveusertest

hisproposedapplicationbeforerepetitiveuse,usingthisdata

asaguide.This productmaybecoveredbyoneor more

UnitedStatesorforeignpatentsorpatentapplications.

Trademarkusage

All trademarks in this document are trademarks and/or

registeredtrademarksofHenkelintheUSandelsewhere.

Reference0.0

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